Stucco and Board Elements
Low density which supports low thermal conductivity allows FRILITE® microspheres to be used as filler in decorative elements, stucco, insulation panels and dry wall board systems.
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Low density which supports low thermal conductivity allows FRILITE® microspheres to be used as filler in decorative elements, stucco, insulation panels and dry wall board systems.
The FRILITE® Group has 20 years of experience with microspheres throughout the whole supply chain: raw material sourcing, microsphere processing, quality control, logistics, product development and support.